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Product Infomation
Product Name Tin (Sn) Microspheres, 10 μm
Catalog Number IMM-MM-012
Physical Specs 10 μm
Description Tin (Sn) Microspheres maintain regular spherical shape and stable chemical performance, possessing reliable brazing and alloying properties for industrial solder preparation, composite material fillers and chemical industry additives.
Applications Metal nano-lubrication additives: Adding 0.1–1% nano-tin powder to lubricating oils and greases forms a self-lubricating, self-healing film on the surfaces of friction pairs during friction, thereby improving the anti-wear and friction-reducing properties of the friction pairs. Sintering activator: In powder metallurgy, tin powder reduces the sintering temperature of powder metallurgy products and high-temperature ceramic products. Surface conductive coating treatment for metals and non-metals: Coating is applied under oxygen-free conditions at temperatures below the powder’s melting point; this technology is applicable to the production of microelectronic devices. Used in industries such as metallurgy, electronics, electrical appliances, chemicals, building materials, machinery, and food packaging. Used in the manufacture of solder paste, electrocarbon products, friction materials, oil-impregnated bearings, and powder metallurgy structural materials
Features The product features high purity, uniform particle size, spherical shape, good dispersibility, high oxidation temperature, and good sintering shrinkage.
Particle Size 10 μm
Specific Surface Area 9 m²/g
Color Silver-gray
Density 5.7 g/cm³
Purity 99.9%
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