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Product Infomation
Product Name Tin (Sn) Microspheres, 1 μm
Catalog Number IMM-MM-011
Physical Specs 1 μm
Description Tin (Sn) Microspheres are monodisperse ultra-fine tin microspheres with excellent ductility, electrical conductivity and solderability, perfectly suited for electronic packaging, conductive adhesives and microelectronic interconnection materials.
Applications Metal Nanolubricant Additives: Adding 0.1–1% nano-tin powder to lubricating oils and greases forms a self-lubricating, self-healing film on the surfaces of friction pairs during friction, thereby reducing wear and friction. Sintering Activation Additives: In powder metallurgy, tin powder lowers the sintering temperature of powder metallurgy products and high-temperature ceramic products. Surface conductive coating treatment for metals and non-metals: Coating is applied under oxygen-free conditions at temperatures below the powder’s melting point; this technology is applicable to the production of microelectronic devices. Used in metallurgy, electronics, electrical appliances, chemicals, building materials, machinery, and food packaging industries. Used in the manufacture of solder paste, electrocarbon products, friction materials, oil-impregnated bearings, and powder metallurgy structural materials
Features The product features high purity, uniform particle size, spherical shape, good dispersibility, high oxidation temperature, and good sintering shrinkage.
Particle Size 1 μm
Specific Surface Area 12 m²/g
Color Silver-black
Density 5.7 g/cm³
Purity 99.9%
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