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As one of the key processes takes place in semiconductor fabrication, the purpose of photolithography is to transfer geometric patterns to a film or substrate. First, a photoresist layer is spin coated on silicon wafer, and mask aligner uses optical radiation to image the mask on the silicon wafer coated with photoresist layers. After wet chemical development, on negative photoresists the exposed area is polymerized and rendered insoluble to developer solution, while on positive photoresists the exposure decomposes a development inhibitor and the developer only dissolve the exposed area. At Matexcel, our photolithography process achieves minimum feature sizes down to one to two microns. To achieve additive or subtractive patterning with different materials, etch-back or lift-off techniques are always carried out during photolithography process.

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